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 Agilent HLMP-PB00-N0000, HLMP-PM00-N0000, HLMP-QB00-S0000, HLMP-QM00-S0000 Subminiature Blue and Green InGaN LED Lamps
Data Sheet
Features * Subminiature flat top package Ideal for backlighting and light piping applications * Subminiature dome package Nondiffused dome for high brightness * Colors: 468 nm blue, 525 nm green * Ideal for space limited applications * Axial leads * Available with lead configurations for surface mount and through hole PC board mounting Applications * Consumer * Industrial * Computer peripheral * Communication
Description
Flat Top Package
Lead Configurations
The HLMP-Pxxx flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.
Dome Package
The HLMP-Qxxx dome lamps use an untinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern.
All these devices are made by encapsulating LED chip on axial lead frames to form molded epoxy subminiature lamps. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bend at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature Lamps data sheet.
CAUTION: HLMP-xB00 and HLMP-xM00 LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Agilent Application Note AN-1142 for additional details.
Package Dimensions (A) Flat Top Lamps
0.50 (0.020) REF. 1.40 (0.055) 1.65 (0.065) 11.68 (0.460) 10.67 (0.420) BOTH SIDES CATHODE
ANODE 1.65 (0.065) DIA. 1.91 (0.075) 0.20 (0.008) MAX.
0.46 (0.018) 0.56 (0.022) 0.25 (0.010) MAX.* NOTE 2
2.21 (0.087) 1.96 (0.077) 1.14 (0.045) 1.40 (0.055)
0.63 (0.025) 0.38 (0.015) 2.44 (0.096) 1.88 (0.074)
0.79 (0.031) MAX. 0.18 (0.007) 0.23 (0.009) 2.08 (0.082) 2.34 (0.092)
CATHODE STRIPE NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD. * REFER TO FIGURE 1 FOR DESIGN CONCERNS.
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Package Dimensions B) Domed Lamps
0.50 (0.020) REF. 11.68 (0.460) 10.67 (0.420) BOTH SIDES CATHODE
ANODE 1.65 (0.065) DIA. 1.91 (0.075) 0.20 (0.008) MAX.
0.46 (0.018) 0.56 (0.022) 0.25 (0.010) MAX.* NOTE 2
0.18 (0.007) 0.23 (0.009) 2.03 (0.080) 1.78 (0.070)
2.21 (0.087) 1.96 (0.077)
0.76 (0.030) R. 0.89 (0.035) 0.94 (0.037) 1.24 (0.049)
2.92 (0.115) MAX. 0.63 (0.025) 0.38 (0.015) 2.08 (0.082) 2.34 (0.092)
0.79 (0.031) 0.53 (0.021)
CATHODE STRIPE NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD. * REFER TO FIGURE 1 FOR DESIGN CONCERNS.
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CATHODE TAB
NO. ANODE DOWN.
YES. CATHODE DOWN.
Figure 1. Proper right angle mounting to a PC board to prevent protruding cathode tab from shorting to anode connection.
Device Selection Guide Part Number HLMP-PB00-N0000 HLMP-PM00-N0000 HLMP-QB00-S0000 HLMP-QM00-S0000 Color Blue Green Blue Green Viewing Angle 21/2 85 20 Package Description Flat Top, Nondiffused, Untinted Domed, Nondiffused, Untinted Package Outline A B
Ordering Information HLMX-XXXX-X X X X X Packaging Option Color Bin Selection Max. Iv Bin
Min. Iv Bin 4 x 4 Prod. Part Number
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Absolute Maximum Ratings at TA = 25C Parameter Peak Forward Current DC Forward Current[1] Power Dissipation Reverse Voltage (I R = 10 A) Operating Temperature Range Storage Temperature Range LED Junction Temperature Lead Soldering Temperature [1.6 mm (0.063 in.) from body] SMT Reflow Soldering Temperature
Note: 1. Derate linearly as shown in Figure 5.
Value 90 mA 30 mA 110 mW 5V -40C to +85C -55C to +100C 110C 260C for 5 seconds 260C for 20 seconds
Optical Characteristics at TA = 25C Luminous Intensity Iv (mcd) @ IF = 20 mA Min. Typ. 25 60 25 200 160 290 160 690 Peak Wavelength PEAK (nm) Typ. 470 523 470 523 Color, Dominant Wavelength d (nm) Typ. 468 525 468 525 Spectral Halfwidth 1/2 (nm) Typ. 26 36 26 36 Viewing Angle 21/2 Degrees Typ. 85 85 20 20 Luminous Efficacy v (lm/W) 70 500 70 500
Part Number HLMP-PB00-N0000 HLMP-PM00-N0000 HLMP-QB00-S0000 HLMP-QM00-S0000
Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 3.7 4.1 3.7 4.1 3.7 4.1 3.7 4.1 Reverse Breakdown VR (Volts) @ I R = 100 A Min. 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 52 52 52 52 Thermal Resistance RJ-PIN (C/W) Typ. 170 170 170 170
Part Number HLMP-PB00-N0000 HLMP-PM00-N0000 HLMP-QB00-S0000 HLMP-QM00-S0000
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1.0
35
IF - FORWARD CURRENT - mA
BLUE GREEN
1.6 1.4
0.9
30
RELATIVE INTENSITY
RELATIVE INTENSITY
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1
25 20 15 10 5 0 0 1 2 3 4 5 VF - FORWARD VOLTAGE - V
1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 35
0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm
DC FORWARD CURRENT - mA
Figure 2. Relative intensity vs. wavelength.
Figure 3. Forward current vs. forward voltage.
Figure 4. Relative luminous intensity vs. DC forward current.
MAXIMUM FORWARD CURRENT - mA
35 30 25 20 15 10 5 0 0 20 40 60 80 100 RJ-A = 550C/W RJ-A = 400C/W
RELATIVE INTENSITY
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE - C
ANGLE - DEGREES
Figure 5. Maximum forward current vs. ambient temperature. Derating based on TJ MAX = 110C.
Figure 6. Relative luminous intensity vs. angular displacement for HLMP-Qxxx.
1.0 0.9
RELATIVE INTENSITY
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE - DEGREES
Figure 7. Relative luminous intensity vs. angular displacement for HLMP-Pxxx.
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Intensity Bin limits Bin N P Q R S T U V W X Y Min. 25 40 63 100 160 250 400 630 1000 1600 2500 Max. 50 80 125 200 320 500 800 1250 2000 3200 5000
Color Bin limits Package Blue Bin 0 1 2 3 4 5 6 0 3 4 5 6 Min. Max. Full Distribution 460 464 464 468 468 472 472 476 476 480 480 484 Full Distribution 520 525 525 530 530 535 535 540
Green
Tolerance of each bin limit = 2 nm.
Mechanical Option 00 11 12 14 21 22 24 31 32 34 Straight Leads, Bulk Packaging, Quantity of 500 Parts Gull Wing Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel Gull Wing Lead, Bulk Packaging, Quantity of 500 Parts Gull Wing Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Yoke Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel Yoke Leads, Bulk Packaging, Quantity of 500 Parts Yoke Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Z-Bend Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel Z-Bend Leads, Bulk Packaging, Quantity of 500 Parts Z-Bend Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel
Note: All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information.
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www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. Obsoletes 5988-4572EN September 30, 2004 5989-1710EN


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